Multi-layer circuit board

Details Multi-layer circuit board Multi-layer circuit board

1985-07-17

1987-06-23

Kucia, R. R.

Electricity: electrical systems and devices

Miscellaneous

174 36, 174 685, H05K 114

Patent

active

046757880

ABSTRACT:
A multi-layer circuit board which includes at least two boards carrying conductors and a shielding foil interposed between the two boards. The circuit board is provided with a through hole including a metallic lining in electrical connection with the shielding foil. The lining includes an insulating layer on which a conductive metal layer is disposed. The metal layer, electrically separated from the lining by the insulating layer, is in electrical connection at respective ends thereof with the conductors. By virtue of this arrangement a coaxial design of a through hole results thereby permitting a total decoupling with respect to adjacent or neighboring through hole connections.

REFERENCES:
patent: 3351816 (1967-11-01), Sear et al.
patent: 3499219 (1970-03-01), Griff et al.
patent: 3875478 (1975-04-01), Capstick
patent: 4170819 (1979-10-01), Peter et al.
patent: 4173745 (1979-11-01), Saunders
patent: 4362899 (1982-12-01), Borrill
Daughton et al., Feed-Through Connectors to Striplines Evaporated on Insulated Ground Planes, IBM Tech. Disc. Bull., vol. 7#2, Jul. 1964, p. 153.

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