Multi-layer chip coil

Details Multi-layer chip coil Multi-layer chip coil

1986-09-10

1987-08-25

Kozma, Thomas J.

Inductor devices

Coil or coil turn supports or spacers

Printed circuit-type coil

336225, H01F 500, H01F 2728

Patent

active

046895949

ABSTRACT:
A multi-layer chip coil which comprises a stack of intermediate laminas of magnetizeable material having a through-hole defined therein so as to extend completely through the thickness thereof, first and second patterned electric conductors formed on the opposite surfaces of each of the intermediate laminas, respectively, and an electroconductive element extending through the through-hole so as to connect the first and second conductors together. The intermediate laminas are stacked one above the other with the first and second conductors in one intermediate lamina partially overlapping in contact with the second conductor in the neighboring intermediate lamina immediately thereabove and the first conductor in the neighboring intermediate lamina immediately therebelow, respectively, whereby the first and second conductors in all of the intermediate laminas, which are connected in series with each other through the respective conductive element, are connected in series with each other.

REFERENCES:
patent: 3765082 (1973-10-01), Zyetz
patent: 4543553 (1985-09-01), Mandai et al.

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