Multi-layer chip capacitor

Details Multi-layer chip capacitor Multi-layer chip capacitor

2007-11-06

2007-11-06

Ha, Nguyen T. (Department: 2831)

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

C361S306100, C361S321200, C361S321400, C361S311000, C361S313000

Reexamination Certificate

active

11272877

ABSTRACT:
A multi-layer chip capacitor includes a capacitor body; first and second internal electrodes alternately arranged therein and separated by dielectric layers, each of the internal electrodes having at least one opening formed at one or more sides thereof; first and second conductive vias passing through the openings and electrically connected to the first and second internal electrodes, respectively; first and second terminal electrodes of opposite polarities formed on one or more side faces of the capacitor body; and first and second lowermost electrode patterns being coplanar, each pattern including a via contact portion and a lead portion extending therefrom. The first and second lowermost electrode patterns are connected to the first and second terminal electrodes, respectively, through the respective lead portions of the lowermost patterns.

REFERENCES:
patent: 5880925 (1999-03-01), DuPré et al.
patent: 6243253 (2001-06-01), DuPre et al.
patent: 6407907 (2002-06-01), Ahiko et al.
patent: 6496355 (2002-12-01), Galvagni et al.
patent: 6542352 (2003-04-01), Devoe et al.
patent: 2003-0064887 (2003-08-01), None
patent: WO 02/054421 (2002-07-01), None
Korean Office Action Issued in corresponding Korean Patent Application No. KR 10-2004-0101411, dated Oct. 25, 2006.

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