Multi-layer ceramic substrate having high TC superconductor circ

Details Multi-layer ceramic substrate having high TC superconductor circ Multi-layer ceramic substrate having high TC superconductor circ

1997-11-12

1999-12-14

King, Roy V.

Superconductor technology: apparatus, material, process

High temperature devices, systems, apparatus, com- ponents,...

Superconductor having metal connect, pad, connect structure,...

505236, 428930, H01L 3900

Patent

active

06002951&

ABSTRACT:
A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.

REFERENCES:
patent: 4137628 (1979-02-01), Suzuki
patent: 4234367 (1980-11-01), Herron et al.
patent: 4803110 (1989-02-01), Ahn et al.
patent: 4902371 (1990-02-01), Andris et al.
patent: 5274268 (1993-12-01), Yamazaki
patent: 5747873 (1998-05-01), Talisa et al.
Van Nostrand Reinhold, "Microelectronics Packaging Handbook", 1989, pp. 476-493 No month data.

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