Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-08-18
1999-10-26
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361761, 361803, 361763, 361764, 439 66, 439 65, 257774, 257700, 257692, 174261, 174250, 174256, 174260, 22818012, 228116, H05K 702
Patent
active
059739282
ABSTRACT:
A multi-layer ceramic module comprises a multi-layer ceramic substrate having an upper side and a lower side, at least one semiconductor chip mounted on the upper side of the substrate, a plurality of module pins projecting from the lower side of the substrate and at least one decoupling capacitor mounted on the lower side of the substrate between adjacent ones of the module pins.
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IBM Technical Disclosure Magdo, S. Low Inductance Module, Oct. 1978 vol. 21 No. 5.
IBM Technical Disclosure Hansen et al. Circuit Module with Bottom-Mounted Decoupling Capacitors, Mar. 1985 vol. 27No. 10A.
Blasi Charles J.
Das Gobinda
Motika Franco
Foster David
International Business Machines - Corporation
Neff, Esq. Daryl K.
Picard Leo P.
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