Multi-layer ceramic substrate assembly and a process for manufac

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428210, 428426, 428432, 428901, 156 89, 156625, B32B 900

Patent

active

050615521

ABSTRACT:
A multi-layer ceramic substrate assembly comprising a multi-layer ceramic substrate including a via-conductor and an interconnecting line and having a surface, a first soldering pad on the surface of the substrate and electrically connected to the via-conductor, a second soldering pad on the surface of the substrate adjacent to the first soldering pad, a connecting pattern on the surface of the substrate for electrically connecting the first and second soldering pads, the connecting pattern being made of an electric conductor wettable with a solder, and a solder dam formed on the connecting pattern between the first and second soldering pads, the solder dam being made of a metal or a metal alloy or compound not wettable with a solder. The electric conductivity of the connecting pattern is carried by a metal having a good electric conductivity and the solder dam is made of a metal or a metal alloy or compound not wettable with a solder, whereby the solder dam stops a flow of a solder through the dam or under the dam. A simple and reliable process for forming such a solder dam is also provided.

REFERENCES:
patent: 3268653 (1966-08-01), McNutt
patent: 3568312 (1971-03-01), Perricone
patent: 3576722 (1971-04-01), Fennimore et al.
patent: 3742597 (1973-07-01), Davis
patent: 4490429 (1984-12-01), Tosaki et al.

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