Multi-layer ceramic packages

Details Multi-layer ceramic packages Multi-layer ceramic packages

1991-07-29

1994-09-06

Picard, Leo P.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257703, H01L 2302

Patent

active

053450388

ABSTRACT:
A method for making multi-layer ceramic packages. The method provides for attaching contact pins to a ceramic substrate after the application of an intermediate metal layer and an outer metal layer. This eliminates plating the contact pins with an intermediate metal layer and an outer metal layer, thereby saving material and process time.

REFERENCES:
patent: 4675243 (1987-06-01), Obinata et al.

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