Multi-layer ceramic feedthrough structure in a transmitter...

Details Multi-layer ceramic feedthrough structure in a transmitter... Multi-layer ceramic feedthrough structure in a transmitter...

2005-03-15

2005-03-15

Ngo, Hung V. (Department: 2831)

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

C361S752000, C361S809000, C385S092000, C174S050510, C257S698000

Reexamination Certificate

active

06867368

ABSTRACT:
A multi-layer feedthrough structure for use in optoelectronic equipment. The feedthrough structure is composed of multiple stacked ceramic layers that together form a multi-layer platform. The multi-layer platform bisects the base portion of a header assembly that is located within the transmitter optical subassembly such that an interior portion of the multi-layer platform is located within the header assembly and an exterior portion is disposed outside. Each layer contains at least a portion of a plurality of conductive pathways that extend from the exterior to the interior portion of the multi-layer platform. A top insulating layer enables the conductive pathways to pass from the exterior to the interior portion of the platform without electrically contacting the header assembly base. The conductive pathways serve as electrical interconnects between components located within the header assembly and structures outside thereof.

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