Multi-layer board with decoupling function

Details Multi-layer board with decoupling function Multi-layer board with decoupling function

2007-02-22

2008-08-26

Dinh, Tuan (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S763000, C361S764000

Reexamination Certificate

active

07417870

ABSTRACT:
A multi-layer board having a superior decoupling function in a low frequency band and a radio frequency band. The multi-layer board includes a board body having a plurality of stacked dielectric layers, power terminals connected through a via, ground terminals connected through a via and an integrated circuit component connected to the power and ground terminals. The multi-layer board also includes a power line unit connected to the power terminals and the integrated circuit component and a ground line unit connected to the ground terminals and the integrated circuit component. The multi-layer board further includes at least one multilayer chip capacitor mounted on the board body and connected between the power terminal and the ground terminal formed on the board body and at least one thin film capacitor mounted inside the board body and connected between the power line unit and the ground line unit.

REFERENCES:
patent: 6611419 (2003-08-01), Chakravorty
patent: 6619419 (2003-09-01), Cheron et al.
patent: 6724638 (2004-04-01), Inagaki et al.
patent: 6920051 (2005-07-01), Figueroa et al.
patent: 6940710 (2005-09-01), Lee et al.
patent: 7035079 (2006-04-01), Park et al.
patent: 2002/0076919 (2002-06-01), Peters et al.
patent: 2005/0024824 (2005-02-01), Riebel
patent: 2005/0277389 (2005-12-01), Friedrich et al.
patent: 2006/0012967 (2006-01-01), Asai et al.
patent: 2005-277389 (2005-10-01), None
Korean Office Action issued in corresponding Korean Patent Application No. KR 10-2006-0017418, dated Feb. 13, 2007.

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