Multi-layer board possessing a varnish surface, process for its

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

1562755, 1562757, 1563074, 427 44, B05D 306, C09J 502

Patent

active

045016356

ABSTRACT:
The invention provides a multi-layer board of from 0.3 to 5.0 mm. thick, comprising an upper layer of a finishing coat which is a varnish hardened by means of electron radiation, one or more carrier films and, optionally, a backing film.

REFERENCES:
patent: 3929545 (1975-12-01), Van Dyck et al.
patent: 4113894 (1978-09-01), Koch

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