Multi-layer board manufacturing method

Details Multi-layer board manufacturing method Multi-layer board manufacturing method

2007-10-30

2007-10-30

Trinh, Minh (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S841000, C029S851000, C174S260000, C257S790000, C361S763000

Reexamination Certificate

active

11211526

ABSTRACT:
Two types of resin films are prepared for manufacturing a multi-layer board containing a chip component. A fist type has a via hole for the chip component to be inserted into, while a second type does not have the via hole. Resin films including the two types are piled before the chip component is inserted. At least a given resin film of the first type has a via hole provided with protruding members. Of the protruding members, opposing protruding members form a gap between their tips. This gap is shorter than an outer dimension of the inserted chip component. The chip component crushes portion of the tips of the protruding members while being pressed and inserted into the via hole in the given resin film.

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patent: 2004/0091687 (2004-05-01), Kondo et al.
patent: A-5-335742 (1993-12-01), None
patent: A-2003-332482 (2003-11-01), None

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