Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2011-03-01
2011-03-01
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S686000, C257SE25005, C257SE25006, C257SE25013, C257SE25021, C257SE25027, C257SE23085
Reexamination Certificate
active
07898091
ABSTRACT:
In a first embodiment, an apparatus and a method of fabrication thereof includes a substrate, a controller formed on a first integrated circuit (IC) die and disposed on the substrate, a second IC die embodying circuitry configured to enable communication between the controller and an external device, first I/O pads disposed on the first IC die, second I/O pads disposed on the second IC die, wire bonding interconnections coupling at least one of the first I/O pads with at least one of the second I/O pads, and a memory array formed on a third IC die and configured to enable communication with the controller. In a second embodiment the memory array is alternatively integrated into the first IC die.
REFERENCES:
patent: 6414384 (2002-07-01), Lo et al.
patent: 6492727 (2002-12-01), Nishizawa et al.
patent: 7345361 (2008-03-01), Mallik et al.
patent: 7576433 (2009-08-01), Ishino et al.
McCarthy Michael
Parikh Dhaval
Sprouse Steven T.
Brinks Hofer Gilson & Lione
Clark Jasmine J
SanDisk Corporation
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