Multi-heatsink integrated cooling device

Details Multi-heatsink integrated cooling device Multi-heatsink integrated cooling device

2007-09-04

2007-09-04

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S695000, C361S700000, C165S080300, C165S121000, C174S016300

Reexamination Certificate

active

11226779

ABSTRACT:
A multi-heatsink integrated cooling device comprises a crossflow cooler and a primary heatsink thermally connected by heat-spreading means. The crossflow cooler comprises a casing with an inlet and an outlet, and a radial impeller and heat-exchanging means located inside of the casing. The casing comprises side parts, a cover and a lower plates contacted with the heat-exchanging means and first of the electronic components. The primary heatsink comprises housing and heat-exchanging members located inside of the housing. The housing comprises a base, sidewalls and a cover, thus forming inflow and outflow openings. The base contacted with the heat-exchanging members and second of the electronic components. The primary heatsink and the crossflow cooler located in such a way that the outflow opening is adjacent to the inlet, thus cooling air flows through the primary heatsink, the inlet, the heat-exchanging means, the radial impeller and the outlet in a series way.

REFERENCES:
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patent: 6525940 (2003-02-01), Chen et al.
patent: 6712129 (2004-03-01), Lee
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patent: 6798663 (2004-09-01), Rubenstein
patent: 6912128 (2005-06-01), Bird et al.
patent: 2005/0061477 (2005-03-01), Mira

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