Multi-functional solder and articles made therewith, such as...

Details Multi-functional solder and articles made therewith, such as... Multi-functional solder and articles made therewith, such as...

2008-03-18

2008-03-18

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S224000, C228S245000, C257S737000, C257S738000, C438S613000

Reexamination Certificate

active

10932471

ABSTRACT:
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.

REFERENCES:
patent: 4180616 (1979-12-01), Lovering et al.
patent: RE30696 (1981-08-01), Arbib et al.
patent: 4345814 (1982-08-01), Gutbier et al.
patent: 5059272 (1991-10-01), Kono et al.
patent: 5393932 (1995-02-01), Young et al.
patent: 5405577 (1995-04-01), Seelig et al.
patent: 5417771 (1995-05-01), Arita et al.
patent: 5573602 (1996-11-01), Banerji et al.
patent: 5677566 (1997-10-01), King et al.
patent: 5907007 (1999-05-01), Ito et al.
patent: 5933713 (1999-08-01), Farnworth
patent: 6012231 (2000-01-01), Regner et al.
patent: 6048755 (2000-04-01), Jiang et al.
patent: 6059894 (2000-05-01), Pendse
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6081429 (2000-06-01), Barrett
patent: 6097087 (2000-08-01), Farnworth et al.
patent: 6107122 (2000-08-01), Wood et al.
patent: 6238223 (2001-05-01), Cobbley et al.
patent: 6310390 (2001-10-01), Moden
patent: 6329222 (2001-12-01), Corisis et al.
patent: 6367150 (2002-04-01), Kirsten
patent: 6388199 (2002-05-01), Jiang et al.
patent: 6402013 (2002-06-01), Abe et al.
patent: 6566234 (2003-05-01), Capote et al.
patent: 6596559 (2003-07-01), Kodnani et al.
patent: 6610430 (2003-08-01), Thompson, Sr.
patent: 6641679 (2003-11-01), Nishina et al.
patent: 2002/0046627 (2002-04-01), Amita et al.
patent: 2002/0195170 (2002-12-01), Nomura et al.
patent: 2003/0082897 (2003-05-01), Sakuyama et al.
patent: 2004/0250919 (2004-12-01), Saito et al.
patent: 2005/0028887 (2005-02-01), Yamashita et al.
patent: 2005/0029667 (2005-02-01), Yamashita et al.
patent: 404098712 (1992-03-01), None
Bauer, B. and Lathrop, R., “An Introduction to Solder Materials,” pp. 1-9,Surface Mount Technology, Mar. 1998, PennWell Corporation, Nashua, New Hampshire.
Cookson Electronics, Cookson Semiconductor Packaging Materials, Technical Bulletin APPL06, “Bumping BGA Packages, Solder Sphere/Paste Reflow,” http://www.cooksonsemi.com/pdfs/Bumping%20BGA%20Pkgs—2002.pdf, 3 pages, Mar. 2000.
Coyle, R.J. et al., “Solder Joint Attachment Reliability and Assembly Quality of a Molded Ball Grid Array Socket,” 2001 Electronic Components and Technology Conference, 8 pages, IEEE, Inc., Los Alamitos, California, 2001.
Surface Mount Equipment Manufacturers Association, “Reflow Terms and Definitions 4.0.” http://www.ipc.org/html/smema4.pdf, 3 pages, IPC SMEMA Council, Copyright 2001.
Von Hessen, W.P., “Flip Chip—Integrated In A Standard SMT Process,” http://www.uic.com/wcms/images.nsf/(graphiclib)/mc-2512+integrated+in+a+standard+smt+process.pdf/$file/mc-2512+integrated+in+a+standard+smt+process.pdf (accessed May 27, 2002), pp. 1-7, Universal Instruments Coporation.
Xilinx, Inc., “Xilinx Packaging and Thermal Characteristics: Reflow Soldering Process Guidelines,” http://www.xilinx.com/publications/products/packaging/reflow.htm (accessed May 27, 2002), 3 pages.

Affiliated with

Also associated with

Rating

Multi-functional solder and articles made therewith, such as... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-functional solder and articles made therewith, such as..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-functional solder and articles made therewith, such as... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3943532