Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2007-04-10
2007-04-10
Edmondson, Lynne R. (Department: 1725)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C228S180220, C148S024000
Reexamination Certificate
active
10932585
ABSTRACT:
Aspects of the invention provide solder compositions which include two different fluxing agents. One of the fluxing agents promotes melting of a metal of the solder at a first activation temperature and the other fluxing agent promotes melting of the metal at a second activation temperature that is higher than the first activation temperature. This dual-flux solder may be used in manufacturing microelectronic components and microelectronic component assemblies. In one specific application, the solder may be used to manufacture a flip chip or other microelectronic component which includes self-fluxing solder balls. This can obviate the need to apply another flux composition to the solder balls prior to a subsequent component attach reflow operation.
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Jiang Tongbi
Yamashita Tsuyoshi
Edmondson Lynne R.
Perkins Coie LLP
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