Multi-function module

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S825000, C029S874000, C439S062000, C439S951000

Reexamination Certificate

active

08028404

ABSTRACT:
An embodiment is a method and apparatus to provide a multi-function module. A circuit board has a form factor and a connector edge corresponding to a first interface standard. The connector edge includes first and second groups of pin-outs that are mapped to pin-out assignments compatible with the first interface standard and a second interface standard, respectively. A first interface is provided on the circuit board for a first set of devices connected to the first group of pin-outs to operate according to the first interface standard. A second interface is provided on the circuit board for a second set of devices connected to the second group of pin-outs to operate according to the second interface standard.

REFERENCES:
patent: 5954521 (1999-09-01), Yang
patent: 6425766 (2002-07-01), Panella
patent: 6994563 (2006-02-01), Amini et al.
patent: 7104809 (2006-09-01), Huang

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