Multi-function LSI wafers

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29 57A, 29578, 357 70, 357 75, H01L 2348, H01L 2944, H01L 2952, H01L 2960

Patent

active

039848604

ABSTRACT:
A system that is to be placed on a wafer is partitioned into reasonably large functions, each provided with a set of I/O and power pads. The wafer design is called "design A"0 A second wafer design (design B) that is the mirror image of design A is also constructed. Wafers of designs A and B are tested and divided into two groups: group I wafers have relatively few functions that are inoperative; group II wafers have relatively few functions that are operative. Inoperative functions are removed from group I wafers and discarded; good functions are removed from group II wafers and retained. A given function on wafer A is the mirror image of the same function on wafer B. Therefore, a given function from a group II wafer A (or B) can be inverted and attached to a group I wafer B (or A) that has had the corresponding function removed from it. The I/O and power pads of the function removed from the group II wafer are joined to the I/O and power pads remaining on the group I wafer.

REFERENCES:
patent: 3707655 (1972-12-01), Rudolph et al.
patent: 3746973 (1973-07-01), McMahon
patent: 3757175 (1973-09-01), Kim et al.
patent: 3795845 (1974-03-01), Cass et al.
patent: 3795972 (1974-03-01), Calhoun
patent: 3795974 (1974-03-01), Calhoun

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