Metal fusion bonding – Specialized pot – Having means to treat flux or filler
Patent
1981-10-23
1984-06-26
Lin, Kuang Y.
Metal fusion bonding
Specialized pot
Having means to treat flux or filler
228 19, B23K 300
Patent
active
044561636
ABSTRACT:
By providing a multi-faced, heat conducting element incorporating projecting heat insulating material in juxtaposed, spaced relationship to the heat conducting element, a unique, inexpensive, readily produced solder pot is achieved for use in removing and replacing multi-pinned components mounted on printed circuit boards. In the preferred embodiment, the multi-faced heat conducting element incorporates a plurality of different faces, with each face corresponding to the pin configuration of a particular multi-pinned component, thereby achieving a single solder pot which can be employed for a plurality of different multi-pinned components. Furthermore, the preferred embodiment incorporates the heat insulating material formed as side panels, mounted at each end of the multi-faced element, with the heat insulating material possessing overall dimensions which expand upon heating to become greater than the outer dimensions of the multi-faced element. In this way, the solder pot of the present invention assures that the heat insulating material extends beyond the heat conducting element during use, and contact between the heated element and the printed circuit board is eliminated.
REFERENCES:
patent: 3557430 (1971-01-01), Jones
patent: 3731866 (1973-05-01), Mason et al.
patent: 3815806 (1974-06-01), Paxton
patent: 4034202 (1977-07-01), Vandermark
"De-Soldering Device", by Babuka, IBM Technical Disclosure Bulletin, vol. 13, No. 3, Aug. 1970, p. 713.
Lin Kuang Y.
Micro Electronic Systems Inc.
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