Multi-element probe array

Details Multi-element probe array Multi-element probe array

2011-07-05

2011-07-05

Cohen, Lee S (Department: 3739)

Surgery

Diagnostic testing

Structure of body-contacting electrode or electrode inserted...

C600S310000, C600S345000, C607S116000, C029S825000

Reexamination Certificate

active

07974673

ABSTRACT:
A multi-element probe array suitable for sensing or stimulating is disclosed. In one embodiment, the multi-element probe array includes a plurality of microfibers extending longitudinally and oriented substantially parallel to form a bundle. Probe elements are defined by a first subset of the microfibers displaced in a forward direction along the longitudinal axis relative to spacer elements defined by a second subset of the microfibers. Interface elements and communication elements are disposed on the probe elements.

REFERENCES:
patent: 3337838 (1967-08-01), Damiano et al.
patent: 3601759 (1971-08-01), Barker
patent: 4132461 (1979-01-01), Jacques et al.
patent: 4203650 (1980-05-01), Muillet et al.
patent: 4369104 (1983-01-01), Beckley
patent: 5270485 (1993-12-01), Jacobsen
patent: 5599615 (1997-02-01), Swift et al.
patent: 5610747 (1997-03-01), Jacobsen
patent: 5861662 (1999-01-01), Candelore
patent: 6020747 (2000-02-01), Bahns et al.
patent: 6110354 (2000-08-01), Saban et al.
patent: 6128527 (2000-10-01), Howard, III et al.
patent: 6289187 (2001-09-01), Swift et al.
patent: 6330466 (2001-12-01), Hofmann et al.
patent: 6334856 (2002-01-01), Allen et al.
patent: 6444102 (2002-09-01), Tucci et al.
patent: 6462398 (2002-10-01), Jojiki
patent: 6515346 (2003-02-01), Kemeny
patent: 6740214 (2004-05-01), Dobson et al.
patent: 6794984 (2004-09-01), Komatsu
patent: 6829498 (2004-12-01), Kipke et al.
patent: 6851980 (2005-02-01), Nelson et al.
patent: 6892438 (2005-05-01), Hill et al.
patent: 6924439 (2005-08-01), Bonni et al.
patent: 6946851 (2005-09-01), Lee et al.
patent: 6953347 (2005-10-01), McGrath et al.
patent: 6993392 (2006-01-01), Nicolelis et al.
patent: 7010356 (2006-03-01), Jog et al.
patent: 7148428 (2006-12-01), Meier et al.
patent: 7333699 (2008-02-01), Jacobsen et al.
patent: 7603153 (2009-10-01), Jacobsen et al.
patent: 7750446 (2010-07-01), Fjelstad et al.
patent: 2004/0080056 (2004-04-01), Lim et al.
patent: 2004/0094328 (2004-05-01), Fjelstad et al.
patent: 2004/0125515 (2004-07-01), Popovich
patent: 2005/0029009 (2005-02-01), Swift et al.
patent: 2005/0029646 (2005-02-01), Kuzawinski et al.
patent: 2005/0143790 (2005-06-01), Kipke et al.
patent: 2005/0159028 (2005-07-01), Sweetland et al.
patent: 2005/0202695 (2005-09-01), Sweetland et al.
patent: 2005/0230795 (2005-10-01), Furuyama et al.
patent: 2006/0039660 (2006-02-01), Henze et al.
patent: 2007/0142714 (2007-06-01), Shumate et al.
patent: 2039421 (1980-08-01), None
patent: 2004/237077 (2004-08-01), None
Patterson, William et al. “A microelectrode/microelectronic hybrid device for for brain implantable neuroprosthesis applications”: IEEE, Oct. 2004, pp. 1845-1853, vol. 51, No. 10.
Normann, “Sight restoration for individuals with profound blindness”, www.bioen.utah.edu/cni/projects/blindess.htm, Sep. 21, 2005, pp. 1-21.
“LSI Announces Wire-Bond Advance” pp. 1-2.
Brunner et at., “Advanced wire bond looping technology for emerging packages”, SEMI Technical Symposium; Innovations in Semiconductor Manufacturing, 2004, pp. 1-8.
Karnezos et al. 3D Packaging Promises Perfomance, reliability Gains with Small Footprints and Lower Profiles, www.cipscalereview.com, Feb. 2005, pp. 1-6.
Chylak et al. “Overcoming the key barriers in 35 umPitch wire bond packaging: probe, mold, and substrate solutions and trade-offs” SEMI/IEEE, 2002, pp. 1-6.
ESEC “25um fine pitch solution”, 2002, pp. 1-3.
ASE Kaohsiung, “CSP Leadless LGA”, pp. 1-5.
Brunsting et al. “Enhanced optical performance for small form factor LC connectors”: Panduit Corp., pp. 1-5.
Hayes, Jim “Connector types and terminology”: Power and Integrated Building Systems, Editorial, pp. 1-2.
Allan, “Twist-pin concept increases miniature connector reliability” Electronic Design, The authority on emerging technologies for design solutions freescale.com pp. 1-2.
Bell, “Carpenter breaks barrier with nano-miniature connector specification”, Mar. 9, 2005, pp. 1-3. Columbus Federal Voice. pp. 1-3.
Z-Axis Connector Company “Miniature Electronic Connectors”: pp. 1-11.
Glenair MIL-DTL-32139 Nanominiature Connectors “Single row metal shell pigtails (M32139/01 & 02)”: www.glenair.com, 2005, pp. 1-2.
Nano Line—NJS Microminiature, ITT Industries, www.ittcannon.com, p. L-14.
Nano Line—Strip-NT Microminiature, ITT Industries, www.ittcannon.com, p. L-15.
Jacobsen, U.S. Appl. No. 11/637,380, filed Dec. 11, 2006.
Jacobsen, U.S. Appl. No. 11/637,508, filed Dec. 11, 2006.
Jacobsen, U.S. Appl. No. 12/070,580, filed Feb. 19, 2008.
U.S. Appl. No. 12/615,202; filed Nov. 9, 2009; Stephen C. Jacobsen; office action issued Nov. 29, 2010.

Affiliated with

Also associated with

Rating

Multi-element probe array does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-element probe array, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-element probe array will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2733939