Multi-electronic device package comprising at least two substrat

Details Multi-electronic device package comprising at least two substrat Multi-electronic device package comprising at least two substrat

1998-02-03

1999-10-05

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 257738, 361803, H01R 2372, H01L 2312, H01L 23488, H05K 706

Patent

active

059634308

ABSTRACT:
An improved multi-electronic device package for accommodating multiple electronic devices such as integrated circuits, memory chips, or the like, is disclosed. The package includes a thermally and electrically conductive plane positioned between a first substrate and a second substrate. A first electronic device is secured to a first surface of the plane within an opening in the first substrate, and a second electronic device is secured to an opposed second surface of the plane within an opening in the second substrate. The electronic device package includes solder balls attached to the second substrate for electrically coupling and physically attaching the electronic device package to a third circuitized substrate, and solder balls attached to the first substrate for electrically coupling and physically attaching the electronic device package to a second electronic device package in a stacked configuration. The package also includes a first encapsulant that covers the first electronic device and a portion of the first layer of circuitry, and bonds to the second substrate.

REFERENCES:
patent: 5099309 (1992-03-01), Kryzaniwsky
patent: 5579207 (1996-11-01), Hayden et al.
patent: 5642265 (1997-06-01), Bond et al.

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