Multi-electronic device package

Details Multi-electronic device package Multi-electronic device package

1996-07-23

1998-05-05

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

257686, 257738, 257712, 257713, 361707, 361721, 361761, 361754, 361803, H01R 2372, H05K 111

Patent

active

057484520

ABSTRACT:
An improved multi-electronic device package for accommodating multiple electronic devices such as integrated circuits, memory chips, or the like, is disclosed. The package includes a first substrate and a second substrate. A first electronic device is encapsulated within an opening of the first substrate, and a second electronic device is encapsulated within an opening in the second substrate. The electronic device package includes solder balls attached to the second substrate for electrically coupling and physically attaching the electronic device package to a third circuitized substrate, and solder balls attached to the first substrate for electrically coupling and physically attaching the electronic device package to a second electronic device package in a stacked configuration.

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