Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate
2006-10-16
2009-11-10
Clark, Jasmine J (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For high frequency device
C257S181000, C257S484000, C257S275000
Reexamination Certificate
active
07615863
ABSTRACT:
An integrated packaging assembly for an MMIC that uses the semiconductor wafers on which circuit elements are fabricated as the package. The packaging assembly includes a plurality of semiconductor layers that have been diced from the semiconductor wafers, where the semiconductor layers can be made of different semiconductor material. The semiconductor layers define cavities therebetween in which circuit components are fabricated. A sealing ring seals the semiconductor layers together so as to hermetically seal the circuit components within the cavities.
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Chang-Chien Patty
Chung Yun-Ho
Yang Jeffrey Ming-Jer
Clark Jasmine J
Miller John A.
Miller IP Group, PLC
Northrop Grumman Space & Missions Systems Corp.
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