Multi-dimensional compliant thermal cap for an electronic...

Details Multi-dimensional compliant thermal cap for an electronic... Multi-dimensional compliant thermal cap for an electronic...

2007-09-11

2007-09-11

Estrada, Angel R. (Department: 2831)

Electricity: conductors and insulators

With fluids or vacuum

Boxes and housings

C174S520000, C361S719000, C361S704000

Reexamination Certificate

active

10944979

ABSTRACT:
A cooling structure for an electronic device comprises a plate including a thermally conducting material disposed over the electronic device. The cooling structure includes a first support and a second support. One of the first support and the second support provides compliance in the x-y directions, and the other support provides compliance in the z direction. In another embodiment of the present invention, the plate comprises a material having high thermal conductivity.

REFERENCES:
patent: 5862038 (1999-01-01), Suzuki et al.
patent: 5875096 (1999-02-01), Gates
patent: 6285078 (2001-09-01), Nelson
patent: 6870246 (2005-03-01), Mullen et al.
patent: 6939742 (2005-09-01), Bhatia et al.

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