Multi-die semiconductor package

Details Multi-die semiconductor package Multi-die semiconductor package

2005-08-09

2005-08-09

Nelms, David (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S678000, C257S686000, C438S108000, C438S109000

Reexamination Certificate

active

06927497

ABSTRACT:
A semiconducting package includes a first capsule, a second capsule and an adhesive within a recess in a surface of the first capsule that secures the first capsule to the second capsule.

REFERENCES:
patent: 5506753 (1996-04-01), Bertin et al.
patent: 6184064 (2001-02-01), Jiang et al.
patent: 6208521 (2001-03-01), Nakatsuka
patent: 6225695 (2001-05-01), Chia et al.
patent: 6297548 (2001-10-01), Moden et al.
patent: 6433418 (2002-08-01), Fujisawa et al.
patent: 6683377 (2004-01-01), Shim et al.
patent: 2003/0062614 (2003-04-01), Larson
patent: 2003/0148597 (2003-08-01), Tan et al.

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