Multi-device holding structure

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Details

C361S809000, C361S810000, C257S718000, C257S726000, C257S727000, C029S830000

Reexamination Certificate

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10893043

ABSTRACT:
In a multi-device holding structure for integrally holding two heat generative elements which are transistors having through-holes so as to be mounted on a base plate, and a heat sensitive element which is a temperature fuse sandwiched between the heat sensitive elements and is mounted on the base plate, the heat generative elements and the heat sensitive element are covered with a metallic holding member provided with first flat spring segments for urging the heat generative elements on both ends as well as inserting segments extending upward and inserted into the through-holes, and second flat spring segments for supporting the sides of the heat sensitive element.

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Japanese Office Action for Japanese patent application No. 2003-198174, issued Nov. 15, 2006, and English translation thereof, 3 pages.

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