Multi-contact connector for ceramic substrate packages and the l

Details Multi-contact connector for ceramic substrate packages and the l Multi-contact connector for ceramic substrate packages and the l

1978-01-24

1979-05-22

Lake, Roy

Geometrical instruments

29629, 174 52FP, 339 17CF, H01R 306

Patent

active

041556151

ABSTRACT:
A multi-contact electrical connector is disclosed for connecting a plurality of terminal pads on an integrated circuit ceramic substrate package to a like plurality of terminal pads on a printed circuit board. The subject multi-contact electrical connector includes at least two continuous strips of contacts, each formed by a plurality of parallel spaced contact members secured between two webs of flexible insulation material and folded upon themselves. One end of each contact is secured to a pad of a printed circuit board so that the strips are free standing extending normal to the plane of the board and define the periphery of the integrated circuit ceramic substrate package received therebetween. The free ends of the contacts resiliently engage the package pads. A profiled open housing is provided to surround the upper free end of the contacts and provide a resilient backing for them.

REFERENCES:
patent: 3597839 (1971-08-01), Jaccodire
patent: 3753211 (1973-08-01), Pauza et al.
patent: 3877064 (1975-04-01), Scheingold et al.
patent: 3910664 (1975-10-01), Pauza et al.
patent: 4018494 (1977-04-01), Scheingold et al.
patent: 4028794 (1977-06-01), Ritchie et al.
patent: 4045105 (1977-08-01), Lee et al.
patent: 4052118 (1977-10-01), Scheingold et al.
patent: 4094564 (1978-06-01), Cacolici

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