Fishing – trapping – and vermin destroying
Patent
1994-12-20
1997-03-04
Picardat, Kevin
Fishing, trapping, and vermin destroying
437211, 437212, 437216, H01L 2160
Patent
active
056078820
ABSTRACT:
Electronic devices include at least two electronic components in electrical contact by connector means, the components being at least partially encased by a molded resin. Preferably, the connector means is a compression connector and the molded resin maintains a compressive force on the connector to ensure that reliable contact is maintained.
REFERENCES:
patent: 4810671 (1989-03-01), Bhattacharyya et al.
patent: 4810672 (1989-03-01), Schwarzbauer
patent: 4830979 (1989-05-01), Crowe et al.
patent: 5053358 (1991-10-01), Crowe et al.
patent: 5086018 (1992-02-01), Conru et al.
patent: 5179039 (1993-01-01), Ishida et al.
patent: 5215472 (1993-05-01), DelPrete et al.
patent: 5331235 (1994-07-01), Chun
patent: 5447888 (1995-09-01), Takashima et al.
patent: 5483024 (1996-01-01), Russell et al.
S. Lenoard Spitz, Designer Thermoplastics Resist High Heat, Electronic Packaging & Production, Oct., 1987, pp. 56-58.
J. G. Sommer, Molding of Rubber for High Performance Applications, Rubber Chem. Technol., Jul.-Aug. 1985, pp. 662-683.
Kaushik S. Akkapeddi, The Design of Some Novel 0.050-In. Grid High-Density Circuit Pack-to-Backplane Connectors, Proceedings: 39th Electronic Components Conf., May, 1989, pp. 92-98.
W. L. Brodsky et al., Featured Elastomer Design for Connector Applications, Proceedings: 43rd Electronic Components and Technology Conf., 1993, pp. 465-467.
A. Spencer, Elastomeric Connectors - A Flexible Friend?, New Electronics, Jun. 26, 1984, pp. 56-59.
C. A. Dalamangas, et al., Testing Proves Conductive Elastomeric Connector Reliability, 8th Annual Connector Symposium, Oct., 1975, pp. 177-190.
Bruce Freyman, et al., Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging Solution for Consumer and Industrial Electronics, 41st Electronic Components and Technology Conf., 1991, pp. 176-182.
Lambert William R.
Weld John D.
Lucent Technologies - Inc.
Picardat Kevin
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