Multi-component barrier polishing solution

Details Multi-component barrier polishing solution Multi-component barrier polishing solution

2006-02-08

2010-11-30

Norton, Nadine G (Department: 1713)

Compositions

Etching or brightening compositions

C438S693000, C438S427000, C216S088000, C252S079500

Reexamination Certificate

active

07842192

ABSTRACT:
The polishing solution is useful for removing barrier materials in the presence of at least one nonferrous interconnect metal with limited erosion of dielectrics. The solution contains 0 to 20 weight percent oxidizer, at least 0.001 weight percent inhibitor for reducing removal rate of the nonferrous interconnect metals, 1 ppm to 4 weight percent organic-containing ammonium cationic salt formed with a quanternary ammonium structure, 1 ppm to 4 weight percent anionic surfactant, the anionic surfactant having 4 to 25 carbon atoms and the total carbon atoms in of the ammonium cationic salt plus the anionic surfactant being 6 to 40 carbon atoms, 0 to 50 weight percent abrasive and balance water; and the solution having a pH of less than 7.

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STIC Search Result, Chemical Abstract, including US Patent 6447563, (Sep. 10, 2002), pp. 65 to 68.

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