Multi-chip type image sensor

Radiant energy – Photocells; circuits and apparatus – Photocell controlled circuit

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358 30, H01J 4014

Patent

active

049994840

ABSTRACT:
A multi-chip type image sensor includes, a base, a plurality of sensor chips arranged on the base so as to be staggered so that adjacent sensor chips among the sensor chips partially overlap with each other in the direction perpendicular to a direction in which the sensor chips are arranged. The sensor chips are fastened to the base by an adhesive for use in die bonding. Each of the sensor chips has a plurality of light receiving elements arranged into a line at a predetermined pixel pitch Pd. Each of the sensor chip contains silicon. Therminal pins are supported on the base and electrically coupled to the sensor chips. The following formula is satisfied:

REFERENCES:
patent: 4418284 (1983-11-01), Ogawa et al.
patent: 4467342 (1984-08-01), Tower
patent: 4523102 (1985-06-01), Kazufumi et al.

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