Multi-chip substrate

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond

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Details

428209, 4284111, 428419, 428435, 428457, 428458, 428461, 4284735, 428901, B32B 300

Patent

active

055144497

ABSTRACT:
An interconnect substrate comprising a metal-polymer composite incorporating microelectronic circuitry, which interconnect substrate is characterized by the feature that the polymer comprises alternating layers of thermoset and thermoplastic resins, said thermoplastic resins being resistant to the highest temperature to which the interconnect substrate may be heated, said thermoset resins being selected from the group consisting of bismaleimides, thermosetting polyimides, benzocyclobutenes and cyanate esters, said thermoplastic resin being selected from the group consisting of preimidized polyetherimides, and polyesters including polyacrylates, polyamides, polyvinylacetals, and phenoxy resins, said substrate having a durable base.

REFERENCES:
patent: 3933745 (1976-01-01), Bargain
patent: 4543295 (1985-09-01), St. Clair
patent: 4681795 (1987-07-01), Tuckerman
patent: 4702792 (1987-10-01), Chow et al.
patent: 4770897 (1988-09-01), Wu
patent: 4810332 (1989-03-01), Pan
patent: 5102718 (1992-04-01), Tingerthal et al.

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