Multi-chip semiconductor module and method for making and testin

Details Multi-chip semiconductor module and method for making and testin Multi-chip semiconductor module and method for making and testin

1992-05-26

1993-09-07

Picard, Leo P.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174259, 174255, 257781, 257690, 361728, 361778, 361785, H05K 712

Patent

active

052434982

ABSTRACT:
A multi-chip semiconductor module (10,20) includes a plurality of semiconductor chips (13,13') mounted on a substrate (11) and a plurality of conductive vias (16) extending through the substrate (11). A conductive network (17) formed on the substrate and a plurality of leads (19) are mounted to edges of the substrate (11) and extend away from the substrate (11). Each of the leads (19) is electrically coupled to a contact pad (14) of an integrated circuit chip (13,13'), and each conductive vias (16) has a first end coupled to the conductive network (17) and a second end exposed on the bottom surface of the substrate (11) allowing electrical access to many of the contact pads (14) of the integrated circuit (13,13').

REFERENCES:
patent: 5088008 (1992-02-01), Takeyama et al.
patent: 5151771 (1992-09-01), Hiroi et al.

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