Multi-chip packaging system

Details Multi-chip packaging system Multi-chip packaging system

1981-05-22

1987-04-14

Man-Fu Moy, Joseph

Special receptacle or package

For a building component

Shingle

206330, 206332, 206328, 206460, B65D 7302

Patent

active

046571370

ABSTRACT:
A system for packaging leadless electronic and electrical components for automatic component placement machines including a low-cost, disposable, flexible engineered laminated carrier tape on which leadless components are held, a reel for winding said component tape, the reel being fabricated with a core of solid fiber chipboard and side discs sheets of coated kraft paper such that the carrier tape may be sealed within the coated paper side sheets of the reel and peeled from side sheets while unwinding. The flexible engineered laminated carrier tape includes a stable base layer member, a flexible, expandable and compressible upper member layer of the laminated carrier tape structure, and a creped top cover tape as required including tape drive engaging means integrally formed with said base layer member and spaced recessed areas formed in said carrier tape for receiving leadless components, and further including means to determine the presence or absence of components in each of said recessed areas after the carrier tape is loaded with components.

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patent: 4298120 (1981-11-01), Kaneko et al.
patent: 4341825 (1982-07-01), Kemski

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