Multi-chip packaging structure having chips sealably mounted on

Details Multi-chip packaging structure having chips sealably mounted on Multi-chip packaging structure having chips sealably mounted on

1998-03-11

2000-06-06

Kincaid, Kristine

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

174 522, 257723, 257730, 257793, H01L 2302, H05K 506

Patent

active

060721227

ABSTRACT:
In a method for manufacturing an electronic apparatus, an electronic component is mounted on an organic substrate within its cavity. The electronic component is sealed by a concave molded resin enveloper filled into the cavity.

REFERENCES:
patent: 5422514 (1995-06-01), Griswold et al.
patent: 5610799 (1997-03-01), Kato

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