Multi-chip package type semiconductor device

Details Multi-chip package type semiconductor device Multi-chip package type semiconductor device

1991-03-15

1992-08-11

Epps, Georgia Y.

357 74, 357 75, 357 80, H01L 2328

Patent

active

051384337

ABSTRACT:
In a multi-chip package type semiconductor device, semiconductor chips are bonded directly on a bed or a package substrate. This feature improves the head radiation characteristic of the device so that heat generated at the semiconductor chips is effectively dissipated.

REFERENCES:
patent: 4330790 (1982-05-01), Burns
patent: 4729010 (1988-03-01), Tsuchiya et al.
patent: 4742385 (1988-05-01), Kohmoto
patent: 4962415 (1990-10-01), Yamamoto et al.
patent: 5036024 (1991-07-01), Mine et al.
IMC 1988 Proceedings, Tokyo, May 25-27, 1988, pp. 338-344, "Properties of Wiring on Metal Plate Coated with Alumina at High Frequency and Ultra-High Frequency".

Affiliated with

Also associated with

Rating

Multi-chip package type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi-chip package type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi-chip package type semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-350946