Multi-chip package including die paddle with steps

Details Multi-chip package including die paddle with steps Multi-chip package including die paddle with steps

2011-07-19

2011-07-19

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23052, C257SE21705, C257SE23037, C257SE23040, C257S699000, C257S712000, C257S713000, C257S717000, C257S720000, C257S670000, C361S813000, C438S107000

Reexamination Certificate

active

07982293

ABSTRACT:
A lead frame assembly includes at least one die paddle. The die paddle includes a first landing area for receiving a first semiconductor chip and a second landing area for receiving a second semiconductor chip. One or more steps are provided between the first landing area and the second landing area.

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