Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate
2006-05-30
2006-05-30
Ngô, Ngân V. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
C257S723000, C438S108000, C365S185090, C714S030000, C714S738000
Reexamination Certificate
active
07053470
ABSTRACT:
A die with embedded memory is packaged together in a same dual-chip package with an EEPROM die. Defects in the embedded memory can be repaired using redundant rows or columns. A built-in self-test (BIST) controller locates defects and a repair image is generated. The repair image is stored in non-volatile memory in the EEPROM die. At power-up, the repair image is copied from the EEPROM die to a volatile repair RAM in the embedded memory die. The redundant rows or columns are mapped to replace defective rows/columns using the repair image in the volatile repair RAM. Although the embedded-memory die has only volatile memory and no fuses, its embedded memory can be repaired using the repair map from the non-volatile EEPROM die. Since the EEPROM die is in the same dual-chip package as the embedded memory die, the repair map is always available.
REFERENCES:
patent: 5058071 (1991-10-01), Kohda et al.
patent: 5608342 (1997-03-01), Trimberger
patent: 5764574 (1998-06-01), Nevill et al.
patent: 5959909 (1999-09-01), Peng et al.
patent: 5963464 (1999-10-01), Dell et al.
patent: 6008538 (1999-12-01), Akram et al.
patent: 6060339 (2000-05-01), Akram et al.
patent: 6178549 (2001-01-01), Lin et al.
patent: 6384630 (2002-05-01), Cliff et al.
patent: 6531339 (2003-03-01), King et al.
patent: 6574763 (2003-06-01), Bertin et al.
patent: 6865694 (2005-03-01), Schutt et al.
patent: 2002/0154553 (2002-10-01), Shubat et al.
patent: 2003/0023914 (2003-01-01), Taylor et al.
patent: 2003/0204782 (2003-10-01), Schutt et al.
Atmeh Elias
Sellers Scott D.
Auvinen Stuart T.
Azul Systems, Inc.
Ngo Ngan V.
Nguyen Tram H.
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