Multi-chip package having improved heat spread...

Details Multi-chip package having improved heat spread... Multi-chip package having improved heat spread...

2003-04-07

2004-08-24

Martin, David (Department: 2841)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S720000, C361S748000, C361S736000, C257S777000, C257S686000, C174S050510, C029S827000, C029S593000

Reexamination Certificate

active

06781849

ABSTRACT:

This application claims priority from Korean Patent Application No. 2002-25626, filed May 9, 2002, the disclosure of which is incorporated herein by reference in its entirety.
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device, and more particularly, to a multi-chip package (MCP) and a method for manufacturing the same.
2. Description of the Related Art
The multi-chip packages (MCPs) including multiple semiconductor chips have been utilized to produce miniaturized and lightweight electronic products with low manufacturing costs and high reliability.
In forming MCPs, the same or different types of multiple semiconductor chips can be included in a single semiconductor package. When the same types of chips are included in a single semiconductor package, in the case of semiconductor memory devices, MCPs have been particularly employed to increase integration of the semiconductor memory devices.
FIG. 1
is a cross-sectional view of a conventional multi-chip package (MCP). Referring to
FIG. 1
, in a conventional MCP
10
, the same types of chips are included in a single semiconductor package. In particular, a first chip
14
is attached to a substrate
12
, and a second chip
18
is attached to the first chip
14
using a spacer adhesive
16
. Subsequently, the MCP
10
is sealed with an epoxy-molding compound (EMC)
24
. Reference numeral
20
denotes a gold wire by which a bond pad of the first and second chips
14
and
18
is connected to a bond finger of the substrate
12
, and reference numeral
22
denotes a solder ball used as an external connection terminal of the MCP
10
.
However, in the conventional MCP
10
, heat generated in the second chip
18
is trapped in the spacer adhesive
16
. Thus, the heat generated in the second chip
18
is not smoothly spread to the substrate
12
and the solder ball
22
because a heat transfer passage is blocked in the spacer adhesive
16
.
The conventional MCP
10
has the following problems. Namely, if the first and second chips
14
and
18
are a highly-integrated memory device operating at high speed, and the electronic devices on which the MCP
10
is mounted are used for miniaturized electronic products such as mobile phones, the refresh characteristics can be degraded by an increase in the temperature of the MCP
10
. Also, the operating speed of the MCP
10
can be decreased and the life time of the MCP
10
can be reduced.
SUMMARY OF THE INVENTION
To solve the above problems, the present invention provides a multi-chip package (MCP) having improved heat spread characteristics, in which heat generated in a chip is not trapped and is smoothly spread and thus the thermal performance of the MCP is improved.
The present invention also provides a method for manufacturing a MCP having improved heat spread characteristics.
According to an embodiment of the present invention, a MCP includes a package substrate including bond fingers formed on a first set of opposite sides thereof. A first chip is attached to the substrate and includes first bond pads formed adjacent the bond fingers of the substrate. A tape is attached to the first chip and the tape includes a conductive material layer or metal core layer therein. A second chip is attached to the tape and the second chip includes second bond pads formed adjacent the bond fingers of the substrate. The bond pads of the first and second chips are electrically connected to the bond fingers of the substrate.
According to another embodiment of the present invention, a method for manufacturing a multi-chip package (MCP) having improved heat spread characteristics is provided.
A package substrate is provided. The package substrate includes bond fingers formed on a first set of opposite sides thereof. The package substrate further includes a ground bonding portion formed on a second set of opposite sides of thereof. A first chip is attached to the substrate. A tape is attached to the first chip. The tape includes a conductive material layer or a core metal layer. And bond pads of the first chip are electrically connected to the bond fingers of the substrate.
With embodiments of the present invention, the heat generated in the second chip can be effectively spread through the heat transfer passage, such as the ground bonding portion, the substrate, and the external connection terminals, through the tape including the conductive material layer having high heat transfer characteristics. Thus, the thermal performance of the MCP can be significantly improved compared to the prior art.


REFERENCES:
patent: 5864177 (1999-01-01), Sundstrom
patent: 6072243 (2000-06-01), Nakanishi
patent: 6307256 (2001-10-01), Chiang et al.
patent: 6414391 (2002-07-01), Corisis et al.
patent: 6555902 (2003-04-01), Lo et al.
patent: 6593662 (2003-07-01), Pu et al.

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