Multi-chip package

Details Multi-chip package Multi-chip package

2005-11-22

2005-11-22

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257S777000

Reexamination Certificate

active

06967394

ABSTRACT:
An auxiliary lead6is arranged so as to support a first semiconductor chip1at a corner of a first face of the first semiconductor chip1and extend toward an outside of the first semiconductor chip1, thereby providing a multi-chip package in which a wire does not pass over the auxiliary lead at time of wire bonding so that the auxiliary lead and the wire may not short-circuit with each other.

REFERENCES:
patent: 6087722 (2000-07-01), Lee et al.
patent: 6410987 (2002-06-01), Kanemoto et al.

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