Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate
2007-05-08
2007-05-08
Ho, Tu-Tu (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified configuration
C257S686000, C257S777000, C257S784000, C257SE23025
Reexamination Certificate
active
10985020
ABSTRACT:
A multi chip package includes a substrate; a first semiconductor chip mounted on the substrate; a second semiconductor chip mounted above the first semiconductor chip; a first bonding wire electrically coupled to a first bonding pad on the first semiconductor chip; and a second bonding wire electrically coupled to a second bonding pad on the second semiconductor chip. At least the first bonding wire is of a coated wire, which comprises a conductive core and an outer insulation coating. At least the first bonding pad is of a multi layered pad, comprising a base pad formed on the first semiconductor chip; a first conductive layer formed on the base pad; and a second conductive layer formed on the first conductive layer.
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Ho Tu-Tu
Rabin & Berdo P.C.
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