Multi-chip modules having chip-to-chip interconnections with red

Details Multi-chip modules having chip-to-chip interconnections with red Multi-chip modules having chip-to-chip interconnections with red

1994-02-24

1995-10-24

Callahan, Timothy P.

Miscellaneous active electrical nonlinear devices, circuits, and

Signal converting, shaping, or generating

Particular stable state circuit

327565, 327333, 326 68, H03K 1710, H03K 17687

Patent

active

054613337

ABSTRACT:
A multi-chip module is composed of two or more integrated-circuit chips located on a substrate such as a dielectrically coated silicon substrate. The chips are interconnected by means of transmission wiring lines. At least some of the chips contain one or more input buffer circuits, each composed of two branches ("legs"). Each such branch contains, in one embodiment, an n-channel MOS transistor connected in series with a pair of series-connected p-channel MOS transistors--whereby, in each such branch, one of the p-channel MOS transistors is located between (intermediate) the other of the p-channel MOS transistors and the n-channel MOS transistor of that same branch. On the other hand, in each buffer circuit, the intermediate p-channel MOS transistors of both branches are cross-coupled. Each of the n-channel MOS transistors is connected in a common gate configuration to receive one of the complementary input signals coming from the transmission wiring lines, and the other of the p-channel transistors in each branch is connected in a common source configuration to receive the other of the complementary input signals.

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Y. Nakagome et al., "Circuit Techniques for 1.5-3.6-V Battery-Operated 64-Mb DRAM," IEEE Journal of Solid-State Circuits, vol. 26, No. 7, Jul. 1991, pp. 1003-1009.
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