Multi-chip module with stacked redundant power

Details Multi-chip module with stacked redundant power Multi-chip module with stacked redundant power

2006-06-27

2006-06-27

Datskovskiy, Michael (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S692000, C361S695000, C361S785000, C257S707000, C257S721000, C174S260000, C165S080300, C307S044000

Reexamination Certificate

active

07068515

ABSTRACT:
Embodiments include apparatus, methods, and systems having a multi-chip module with stacked redundant power. An exemplary apparatus has a module having plural processors. A first power system is coupled, in a vertically stacked configuration, to the module for providing power to the module. A second power system provides power to the module and is coupled, in a vertically stacked configuration, to the first power system. Each power system serves as a duplicate for preventing failure of the module upon failure of one of the power systems. A thermal dissipation device is disposed between both the first and second power systems and the first power system and module such that the thermal dissipation device dissipates heat, via heat exchange, away from the processors, the first power system, and the second power system.

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