Multi-chip module with power system and pass-thru holes

Details Multi-chip module with power system and pass-thru holes Multi-chip module with power system and pass-thru holes

2007-10-30

2007-10-30

Thompson, Greg (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C257S707000, C257S712000, C361S710000, C361S719000

Reexamination Certificate

active

11021500

ABSTRACT:
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.

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David A. Klein, U.S. Appl. No. 10/800,837, filed Mar. 15, 2004, entitled “Multi-Processor Module”.

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