Multi-chip module with multiple compartments

Details Multi-chip module with multiple compartments Multi-chip module with multiple compartments

1992-07-14

1994-11-29

Ledynh, Bot

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174 35R, 257712, 361704, 361688, 361730, H05K 900, H02B 100

Patent

active

053695526

ABSTRACT:
The present invention provides a multi-chip module having multiple compartments. Circuitry is arranged on a substrate in such a manner that circuit components requiring specific operating environments are located in discrete areas dedicated to accommodate the circuit components. A cover, having multiple chambers that align with the discrete areas on the substrate, is secured to the substrate to define the multiple compartments. The compartments are separated by material that effectively isolates the compartments relative to one another.

REFERENCES:
patent: 4370515 (1983-01-01), Donaldson
patent: 4569000 (1986-02-01), Noji
patent: 4658334 (1987-04-01), McSparran et al.
patent: 4717990 (1988-01-01), Tugcu
patent: 4739453 (1988-04-01), Kurokawa

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