Multi-chip module with accessible test pads and test fixture

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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324755, G01R 3100

Patent

active

060940565

ABSTRACT:
A test fixture for use with an improved multi-chip-module wherein the multi-chip-module has a plurality of chips on the top surface, the module having at least one net associated with the chips completely embedded within the substrate and wherein at least one pad is attached to the bottom surface of the substrate and a conductive path provided between the pad and the net. The test fixture includes a zero-insertion-force socket having at least one socket pin having a surface for conductively contacting the pad on the multi-chip-module and extending through the socket and a circuit board having a plurality of inlets for conductively receiving the socket pins including the socket pin contacting the pad.

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IBM Technical Disclosure Bulletin, "AC Chip In-Place Test", M. T. McMahon, Jr., vol. 17, No. 6, pp. 1607-1608., Nov. 1974.

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