Multi-chip module with accessible test pads

Details Multi-chip module with accessible test pads Multi-chip module with accessible test pads

1996-09-11

1998-05-19

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174260, 174261, 361774, 361780, H05K 702

Patent

active

057544107

ABSTRACT:
An improved multi-chip-module having a substrate having top and bottom surfaces, a plurality of chips on the top surface, a plurality of pins on the bottom surface, each chip having at least one lead extending through the substrate and conductively coupled to a corresponding pin, the module having at least one net associated with the chips and completely embedded within the substrate, the improvement comprising at least one pad attached to the bottom surface of the substrate, and a conductive path conductively coupled between the pad and the net.

REFERENCES:
patent: 4489364 (1984-12-01), Chance et al.
patent: 4812742 (1989-03-01), Abel et al.
patent: 4922377 (1990-05-01), Matsumoto et al.
patent: 5243140 (1993-09-01), Bhatia et al.
patent: 5243498 (1993-09-01), Scofield
patent: 5262719 (1993-11-01), Magdo
patent: 5354955 (1994-10-01), Gregor et al.
patent: 5389885 (1995-02-01), Swart
patent: 5477160 (1995-12-01), Love
IBM Technical Disclosure Bulletin "AC Chip In-Place Test" by M. T. McMahon, Jr. vol. 17 No. 6 pp. 1607 and 1608, Nov. 1974.

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