Multi-chip module system and method of fabrication

Details Multi-chip module system and method of fabrication Multi-chip module system and method of fabrication

1996-03-12

1998-09-15

Niebling, John

Semiconductor device manufacturing: process

With measuring or testing

Packaging or treatment of packaged semiconductor

438106, 438112, H01L 2166, H01L 2144

Patent

active

058077626

ABSTRACT:
Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed with appropriate electrical connections. A variety of different dice may be attached to the same vacancy position of an MCM by means of adapters, wherein each adapter has the same footprint, but different adapters are capable of accommodating different numbers and types of dice.

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