Multi-chip module system

Details Multi-chip module system Multi-chip module system

2007-01-23

2007-01-23

Graybill, David E. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

C257S724000, C257S725000, C257S726000, C257SE21526

Reexamination Certificate

active

10032734

ABSTRACT:
Multi-chip module systems and method of fabrication thereof wherein the equivalent of a failed die of a multi-chip module (MCM) is added to the module in a vacancy position previously constructed with appropriate electrical connections. A variety of different dice may be attached to the same vacancy position of an MCM by means of adapters, wherein each adapter has the same footprint, but different adapters are capable of accommodating different numbers and types of dice.

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