Multi chip module substrate

Details Multi chip module substrate Multi chip module substrate

1992-12-22

1994-04-26

Ryan, Patrick J.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

428209, 361718, 257714, B32B 900

Patent

active

053065468

ABSTRACT:
A multi-level substrate (24) for mounting and interconnecting a number of integrated circuit chips (10) is formed of a stack of laminated sheets each comprising a conductive circuit layer (30,34,38,42,46) is laminated to a dielectric film (32,36,40,44,48). The sheets are formed by fully additive or semi-additive processes on a reusable mandrel and are interconnected to one another by raised features (78) on the circuit layer of one sheet that project through a hole (86) in the dielectric film of an adjacent sheet to contact a receiving area (88) of the circuit layer of the adjacent sheet. Integrated circuit chips (10) and other electrical components are mounted to the uppermost sheet and electrically connected thereto by means of wiring bonding (16) or a f lip-chip arrangement (150) in which chip pads (148) rest upon and contact raised features (146) of the circuit layer (140) of the uppermost sheet.

REFERENCES:
patent: 4377316 (1983-03-01), Ecker et al.
patent: 4652970 (1987-03-01), Watari et al.
patent: 4744007 (1988-05-01), Watari et al.
patent: 5189505 (1993-02-01), Bartelink

Affiliated with

Also associated with

Rating

Multi chip module substrate does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Multi chip module substrate, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Multi chip module substrate will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1710587