Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2005-10-12
2008-09-16
Ngo, Ngan (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S724000, C257SE23003, C257SE23078, C257SE23079, C438S110000
Reexamination Certificate
active
07425760
ABSTRACT:
One embodiment of the present invention provides an integrated circuit module. This module includes a semiconductor die with an active face, upon which active circuitry and signal pads reside, and a back face opposite the active face. The module uses a flexible cable to deliver electrical power to the active face of the semiconductor die from a power distribution board located above the active face of the semiconductor die. This flexible cable provides electrical power to the semiconductor die without interfering with the alignment and heat removal functions of the module.
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Guenin Bruce M.
Nettleton Nyles I.
Ngo Ngan
Park Vaughan & Fleming LLP
Sun Microsystems Inc.
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