Multi-chip module packaging with thermal expansion...

Details Multi-chip module packaging with thermal expansion... Multi-chip module packaging with thermal expansion...

2003-08-13

2008-10-21

Reichard, Dean A. (Department: 2841)

Electricity: conductors and insulators

Boxes and housings

With electrical device

C174S520000, C174S521000, C174S527000, C174S528000, C174S529000, C174S551000

Reexamination Certificate

active

07439452

ABSTRACT:
In a transfer-mold configuration of an automotive electronic control unit, the thermal expansion coefficient of the circuit board is made apparently equal to that of the base member to suppress excessive stresses between them. The circuit board and the base member are placed in the center of the transfer-mold structure to make thermal stresses symmetrical and thus suppress strains.

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European Office Action dated Jul. 5, 2006 (Four (4) pages).

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